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Virtual Reality & Intelligent Hardware Editorial Board

Editor-in-Chief

Yong-Tian WANG

Beijing Institute of Technology, China

Advisors

Qin-Ping ZHAO

Beihang University, China

Bo-Hu LI

Beihang University, China

Qiong-Hai DAI

Tsinghua University, China

Guo-Zhong DAI

Institute of Software Chinese Academy of Science, China

Bjoern SCHULLER

Imperial College London, UK

David REMPEL

University of California, USA

Dieter SCHMALSTIEG

Institute of Computer Graphics and Vision at Graz University of Technology, Austria

Enhua WU

University of Macao, China

Hiroo IWATA

University of Tsukuba, Japan

Ji QIANG

Rensselaer Polytechnic Institute, USA

Mark BILLINGHURST

School of Information Technology and Mathematical Sciences, IUniversity of South Australia, Australia

Shin-Tson WU

University of Central Florida, USA

Associate Editors

Hu-Jun BAO

Zhejiang University, China

Xi-lin CHEN

Institute of Computing Technology, Chinese Academy of Sciences, China

Ai-Min HAO

Beihang University, China

Shi-Min HU

Tsinghua University, China

Bin SHENG

Shanghai Jiaotong University, China

Ai-Guo SONG

Southeast University, China

Jian-Hua TAO

Institute of Automation, Chinese Academy of Science, China

Feng TIAN

Institute of Software, Chinese Academy of Science, China

Xiao-Ying SUN

Jilin University, China

Guo-Ping WANG

Peking University, China

Editorial Board

Chi Kit AU

University of Waikato, New Zealand

Mehdi AMMI

University of Patras, USA

Lei BI

The University of Sydney, Australia

Marc BAADEN

National Centre for Scientific Research, France

Andrés Navarro CADAVID

Universidad ICESI, Colombia

Yiyu CAI

Nanyang Technological University, Singapore

Zhanchuan CAI

Macau University of Science and Technology, China

YanLong CAO

Zhejiang University, China

Sanxing CAO

Communication University of China, China

Tolga CAPIN

TED University, Turkey

Jian CHANG

Bournemouth University, UK

YuanFei CHEN

Institute of Computing Technology Chinese Academy of Science in Tianjin Branch of Tianjin, China

DongYi CHEN

University of Electronic Science and Technology of China, China

Baoquan CHEN

Peking University, China

Leiting CHEN

University of Electronic Science and Technology of China, China

Yanyun CHEN

Institute of Software, CAS, China

Dewen CHENG

Beijing Institute of Technology, China

Lianglun CHENG

Guangdong University of Technology, China

Xiaoyu CHI

Goertek Group Co.,Ltd., China

Adrian CLARK

University of Canterbury, New Zealand

Weiwen DENG

Jilin University

Qi DOU

The Chinese University of Hong Kong, China

Henry DUH

La Trobe University, Australia

Xiumin FAN

Shanghai Jiao Tong University, China

Guangzheng FEI

Communication University of China

Dagan FENG

The University of Sydney, Australia

Hongbo FU

City University of Hong Kong, China

Arnulph FUHRMANN

TH Köln, Germany

Li GUO

Hunan University

Song GUO

Hong Kong Polytechnic University, China

Yuansheng GUO

Electronic Components Development Research Center?Ministry of Industry and Information Technology

Yong HAN

Ocean University of China

Pheng Ann HENG

The Chinese University of Hong Kong, China

Zengguang HOU

Institute of Automation, CAS, China

Qiang HUANG

Beijing Institute of Technology

Guoquan HUANG

University of Delaware, USA

Xiangyang JI

Tsinghua University, China

Jinyuan JIA

Tongji University, China

Younhyun JUNG

Gachon University, South Korea

Manolya Kavakli

Macquarie University, Australia

Jinman KIM

The University of Sydney, Australia

Kiyoshi KIYOKAWA

Nara Institute of Science and Technology, Japan

Hoshang KOLIVAND

Liverpool John Moores University, UK

Lingsheng KONG

Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China

Yoshihiro KURODA

University of Tsukuba, Japan

Robert Steven LARAMEE

University of Nottingham, UK

Manfred LAU

City University of Hong Kong, China

Frederich LI

University of Durham, UK

Haifeng LI

Zhejiang University, China

Ping LI

The Hong Kong Polytechnic University, China

Weiping LI

Peking University, China

Xueming LI

Beijing University of Posts and Telecommunications, China

Yuanqing LI

South China University of Technology, China

Baoquan LIU

Huawei Institute of the United Kingdom, UK

Xiaohui LIANG

Beihang University, China

Yue LIU

Beijing Institute of Technology

Minglei LIU

Intelligent Manufacturing Hundred People Association of China, China

Yanli LIU

Sichuan University, China

Yongjin LIU

Tsinghua University, China

Xun LUO

Tianjin University of Technology

Zhihan LV

Qingdao University, China

Xiaoyang MAO

University of Yamanashi, Japan

Khan MUHAMMAD

Sejong University, South Korea

Zhigeng PAN

Hangzhou Normal University, China

George PAPAGIANNAKIS

University of Crete, Greece

Christine PEREY

Perey Research and Consulting, Switzerland

Isidoros PERIKOS

University of Patras, USA

Xiaojuan QI

The University of Hong Kong, China

Yue QI

Beihang University, China

Jing QIN

The Hong Kong Polytechnic University, China

Umesh RAMNARAIN

University of Johannesburg, South Africa

Abdennour El RHALIBI

Liverpool John Moores University, UK

Tanzila SABA

Prince Sultan University, Saudi Arabia

Abdul SADKA

Brunel University London, UK

Shaojie SHEN

University of Pennsylvania, Hong Kong, China

Xukun SHEN

Beihang University, China

Yuanchun SHI

Tsinghua University, China

Quanjun SONG

Institute of Intelligent Machinery, CAS, China

Weitao SONG

Beijing Film Academy, China

Sud SUDIRMAN

Liverpool John Moores University, UK

Simon SU

Army Research Laboratory, USA

Markus TATZGERN

Salzburg University of Applied Sciences, Austria

Haruo Takemura

Cybermedia Center Osaka University, Japan

Bruce Thomas

The University of South Australia Mawson Lakes, Australia

Changhe TU

Shandong University, China

Cong WANG

China Institute of Electronic Technology Standardization, China

Dangxiao WANG

Beihang University, China

Gregory F WELCH

The University of Central Florida, USA

Wei WANG

Beihang University, China

Lejin WANG

Peking University People's Hospital, China

Zhaoqi WANG

Institute of Computing Technology, CAS, China

Dongdong WENG

Beijing Institute of Technology, China

Lun XIE

University of Science and Technology Beijing, China

Le XIE

Shanghai Jiao Tong University, China

Jing XU

Intelligent Manufacturing Hundred People Association of China, China

Mingliang XU

Zhengzhou University, China

Yingqing XU

Tsinghua University, China

Zhenbang XU

Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China

Jianru XUE

Xi'an Jiao Tong University, China

Jian YANG

Beijing Institute of Technology, China

Po YANG

Sheffield University, UK

Hongqing (Harry) YU

University of Derby, UK

Jingyi YU

Shanghai University of Science and Technology, China

Yang YU

Goertek Group Co.,Ltd., China

Hongbin ZHA

Peking University, China

Xin ZHANG

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Science, China

Ping ZHANG

South China University of Technology, China

Fengjun ZHANG

Institute of Software, CAS, China

Yanguo ZHANG

China Communications Industry Association, China

Yunquan ZHANG

Institute of Computing Technology, CAS, China

Guofeng ZHANG

Zhejiang University, China

Yu ZHANG

Stanford University, USA

Jianmin ZHENG

Nanyang Technological University, Singapore

Zhong ZHOU

Beihang University, China

Bin ZHOU

Beihang University, China

Kun ZHOU

Zhejiang University, China

Mingquan ZHOU

Beijing Normal University, China

Zihan ZHOU

Penn State University, USA

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