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Virtual Reality & Intelligent Hardware Editorial Board
Editor-in-Chief
Yong-Tian WANG
Beijing Institute of Technology, China
Email Yong-Tian WANG
Advisors
Qin-Ping ZHAO
Beihang University, China
Bo-Hu LI
Beihang University, China
Qiong-Hai DAI
Tsinghua University, China
Guo-Zhong DAI
Institute of Software Chinese Academy of Science, China
Bjoern SCHULLER
Imperial College London, UK
David REMPEL
University of California, USA
Dieter SCHMALSTIEG
Institute of Computer Graphics and Vision at Graz University of Technology, Austria
Enhua WU
University of Macao, China
Hiroo IWATA
University of Tsukuba, Japan
Ji QIANG
Rensselaer Polytechnic Institute, USA
Mark BILLINGHURST
School of Information Technology and Mathematical Sciences, IUniversity of South Australia, Australia
Shin-Tson WU
University of Central Florida, USA
Associate Editors
Hu-Jun BAO
Zhejiang University, China
Xi-lin CHEN
Institute of Computing Technology, Chinese Academy of Sciences, China
Ai-Min HAO
Beihang University, China
Shi-Min HU
Tsinghua University, China
Bin SHENG
Shanghai Jiaotong University, China
Ai-Guo SONG
Southeast University, China
Jian-Hua TAO
Institute of Automation, Chinese Academy of Science, China
Feng TIAN
Institute of Software, Chinese Academy of Science, China
Xiao-Ying SUN
Jilin University, China
Guo-Ping WANG
Peking University, China
Editorial Board
Chi Kit AU
University of Waikato, New Zealand
Mehdi AMMI
University of Patras, USA
Lei BI
The University of Sydney, Australia
Marc BAADEN
National Centre for Scientific Research, France
Andrés Navarro CADAVID
Universidad ICESI, Colombia
Yiyu CAI
Nanyang Technological University, Singapore
Zhanchuan CAI
Macau University of Science and Technology, China
YanLong CAO
Zhejiang University, China
Sanxing CAO
Communication University of China, China
Tolga CAPIN
TED University, Turkey
Jian CHANG
Bournemouth University, UK
YuanFei CHEN
Institute of Computing Technology Chinese Academy of Science in Tianjin Branch of Tianjin, China
DongYi CHEN
University of Electronic Science and Technology of China, China
Baoquan CHEN
Peking University, China
Leiting CHEN
University of Electronic Science and Technology of China, China
Yanyun CHEN
Institute of Software, CAS, China
Dewen CHENG
Beijing Institute of Technology, China
Lianglun CHENG
Guangdong University of Technology, China
Xiaoyu CHI
Goertek Group Co.,Ltd., China
Adrian CLARK
University of Canterbury, New Zealand
Weiwen DENG
Jilin University
Qi DOU
The Chinese University of Hong Kong, China
Henry DUH
La Trobe University, Australia
Xiumin FAN
Shanghai Jiao Tong University, China
Guangzheng FEI
Communication University of China
Dagan FENG
The University of Sydney, Australia
Hongbo FU
City University of Hong Kong, China
Arnulph FUHRMANN
TH Köln, Germany
Li GUO
Hunan University
Song GUO
Hong Kong Polytechnic University, China
Yuansheng GUO
Electronic Components Development Research Center?Ministry of Industry and Information Technology
Yong HAN
Ocean University of China
Pheng Ann HENG
The Chinese University of Hong Kong, China
Zengguang HOU
Institute of Automation, CAS, China
Qiang HUANG
Beijing Institute of Technology
Guoquan HUANG
University of Delaware, USA
Xiangyang JI
Tsinghua University, China
Jinyuan JIA
Tongji University, China
Younhyun JUNG
Gachon University, South Korea
Manolya Kavakli
Macquarie University, Australia
Jinman KIM
The University of Sydney, Australia
Kiyoshi KIYOKAWA
Nara Institute of Science and Technology, Japan
Hoshang KOLIVAND
Liverpool John Moores University, UK
Lingsheng KONG
Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Yoshihiro KURODA
University of Tsukuba, Japan
Robert Steven LARAMEE
University of Nottingham, UK
Manfred LAU
City University of Hong Kong, China
Frederich LI
University of Durham, UK
Haifeng LI
Zhejiang University, China
Ping LI
The Hong Kong Polytechnic University, China
Weiping LI
Peking University, China
Xueming LI
Beijing University of Posts and Telecommunications, China
Yuanqing LI
South China University of Technology, China
Baoquan LIU
Huawei Institute of the United Kingdom, UK
Xiaohui LIANG
Beihang University, China
Yue LIU
Beijing Institute of Technology
Minglei LIU
Intelligent Manufacturing Hundred People Association of China, China
Yanli LIU
Sichuan University, China
Yongjin LIU
Tsinghua University, China
Xun LUO
Tianjin University of Technology
Zhihan LV
Qingdao University, China
Xiaoyang MAO
University of Yamanashi, Japan
Khan MUHAMMAD
Sejong University, South Korea
Zhigeng PAN
Hangzhou Normal University, China
George PAPAGIANNAKIS
University of Crete, Greece
Christine PEREY
Perey Research and Consulting, Switzerland
Isidoros PERIKOS
University of Patras, USA
Xiaojuan QI
The University of Hong Kong, China
Yue QI
Beihang University, China
Jing QIN
The Hong Kong Polytechnic University, China
Umesh RAMNARAIN
University of Johannesburg, South Africa
Abdennour El RHALIBI
Liverpool John Moores University, UK
Tanzila SABA
Prince Sultan University, Saudi Arabia
Abdul SADKA
Brunel University London, UK
Shaojie SHEN
University of Pennsylvania, Hong Kong, China
Xukun SHEN
Beihang University, China
Yuanchun SHI
Tsinghua University, China
Quanjun SONG
Institute of Intelligent Machinery, CAS, China
Weitao SONG
Beijing Film Academy, China
Sud SUDIRMAN
Liverpool John Moores University, UK
Simon SU
Army Research Laboratory, USA
Markus TATZGERN
Salzburg University of Applied Sciences, Austria
Haruo Takemura
Cybermedia Center Osaka University, Japan
Bruce Thomas
The University of South Australia Mawson Lakes, Australia
Changhe TU
Shandong University, China
Cong WANG
China Institute of Electronic Technology Standardization, China
Dangxiao WANG
Beihang University, China
Gregory F WELCH
The University of Central Florida, USA
Wei WANG
Beihang University, China
Lejin WANG
Peking University People's Hospital, China
Zhaoqi WANG
Institute of Computing Technology, CAS, China
Dongdong WENG
Beijing Institute of Technology, China
Lun XIE
University of Science and Technology Beijing, China
Le XIE
Shanghai Jiao Tong University, China
Jing XU
Intelligent Manufacturing Hundred People Association of China, China
Mingliang XU
Zhengzhou University, China
Yingqing XU
Tsinghua University, China
Zhenbang XU
Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Jianru XUE
Xi'an Jiao Tong University, China
Jian YANG
Beijing Institute of Technology, China
Po YANG
Sheffield University, UK
Hongqing (Harry) YU
University of Derby, UK
Jingyi YU
Shanghai University of Science and Technology, China
Yang YU
Goertek Group Co.,Ltd., China
Hongbin ZHA
Peking University, China
Xin ZHANG
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Science, China
Ping ZHANG
South China University of Technology, China
Fengjun ZHANG
Institute of Software, CAS, China
Yanguo ZHANG
China Communications Industry Association, China
Yunquan ZHANG
Institute of Computing Technology, CAS, China
Guofeng ZHANG
Zhejiang University, China
Yu ZHANG
Stanford University, USA
Jianmin ZHENG
Nanyang Technological University, Singapore
Zhong ZHOU
Beihang University, China
Bin ZHOU
Beihang University, China
Kun ZHOU
Zhejiang University, China
Mingquan ZHOU
Beijing Normal University, China
Zihan ZHOU
Penn State University, USA
