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Virtual Reality & Intelligent Hardware Editorial Board
Editor-in-Chief
Yong-Tian WANG
Beijing Institute of Technology, China
Email Yong-Tian WANG
Advisors
Qin-Ping ZHAO
Beihang University, China
Bo-Hu LI
Beihang University, China
Qiong-Hai DAI
Tsinghua University, China
Guo-Zhong DAI
Institute of Software Chinese Academy of Science, China
Bjorn SCHULLER
Imperial College London, UK
David REMPEL
University of California, USA
Dieter SCHMALSTIEG
Institute of Computer Graphics and Vision at Graz University of Technology, Austria
Enhua WU
University of Macao, China
Hiroo IWATA
University of Tsukuba, Japan
Ji QIANG
Rensselaer Polytechnic Institute, USA
Mark BILLINGHURST
School of Information Technology and Mathematical Sciences, IUniversity of South Australia, Australia
Shin-Tson WU
University of Central Florida, USA
Associate Editor s
Hu-Jun BAO
Zhejiang University, China
Xi-lin CHEN
Institute of Computing Technology, Chinese Academy of Sciences, China
Ai-Min HAO
Beihang University, China
Shi-Min HU
Tsinghua University, China
Ai-Guo SONG
Southeast University, China
Jian-Hua TAO
Institute of Automation, Chinese Academy of Science, China
Feng TIAN
Institute of Software, Chinese Academy of Science, China
Xiao-Ying SUN
Jilin University, China
Guo-Ping WANG
Peking University, China
Editorial Board
Andrés Navarro CADAVID
Universidad ICESI, Colombia
Andrés Adolfo
Pontificia Universidad, Javeriana Cali, Colombia
YanLong CAO
Zhejiang University, China
Sanxing CAO
Communication University of China, China
YuanFei CHEN
Institute of Computing Technology Chinese Academy of Science in Tianjin Branch of Tianjin, China
DongYi CHEN
University of Electronic Science and Technology of China, China
Baoquan CHEN
Peking University, China
Leiting CHEN
University of Electronic Science and Technology of China, China
Yanyun CHEN
Institute of Software, CAS, China
Dewen CHENG
Beijing Institute of Technology, China
Lianglun CHENG
Guangdong University of Technology, China
Xiaoyu CHI
Goertek Group Co.,Ltd., China
Weiwen DENG
Jilin University
Henry DUH
La Trobe University, Australia
Gregory F
The University of Central Florida, USA
Xiumin FAN
Shanghai Jiao Tong University, China
Guangzheng FEI
Communication University of China
Li GUO
Hunan University
Yuansheng GUO
Electronic Components Development Research Center?Ministry of Industry and Information Technology
Yong HAN
Ocean University of China
Zengguang HOU
Institute of Automation, CAS, China
Qiang HUANG
Beijing Institute of Technology
Guoquan HUANG
University of Delaware, USA
Hiroo IWATA
University of Tsukuba, Japan
Xiangyang JI
Tsinghua University, China
Jinyuan JIA
Tongji University, China
Manolya Kavakli
Macquarie University, Australia
Kiyoshi Kiyokawa
Nara Institute of Science and Technology, Japan
Lingsheng KONG
Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Frederich LI
University of Durham, UK
Haifeng LI
Zhejiang University, China
Weiping LI
Peking University, China
Xueming LI
Beijing University of Posts and Telecommunications, China
Yuanqing LI
South China University of Technology, China
Xiaohui LIANG
Beihang University, China
Yue LIU
Beijing Institute of Technology
Minglei LIU
Intelligent Manufacturing Hundred People Association of China, China
Yanli LIU
Sichuan University, China
Yongjin LIU
Tsinghua University, China
Xun LUO
Tianjin University of Technology
Andrés Navarro
Universidad ICESI, Colombia
Zhigeng PAN
Hangzhou Normal University, China
Shaojie SHEN
University of Pennsylvania, Hong Kong, China
Xukun SHEN
Beihang University, China
Yuanchun SHI
Tsinghua University, China
Quanjun SONG
Institute of Intelligent Machinery, CAS, China
Weitao SONG
Beijing Film Academy, China
Haruo Takemura
Cybermedia Center Osaka University, Japan
Bruce Thomas
The University of South Australia Mawson Lakes, Australia
Changhe TU
Shandong University, China
Dangxiao WANG
Beihang University, China
Cong WANG
China Institute of Electronic Technology Standardization, China
Wei WANG
Beihang University, China
Lejin WANG
Peking University People's Hospital, China
Zhaoqi WANG
Institute of Computing Technology, CAS, China
Dongdong WENG
Beijing Institute of Technology, China
Lun XIE
University of Science and Technology Beijing, China
Le XIE
Shanghai Jiao Tong University, China
Jing XU
Intelligent Manufacturing Hundred People Association of China, China
Mingliang XU
Zhengzhou University, China
Yingqing XU
Tsinghua University, China
Zhenbang XU
Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Jianru XUE
Xi'an Jiao Tong University, China
Jian YANG
Beijing Institute of Technology, China
Jingyi YU
Shanghai University of Science and Technology, China
Yang YU
Goertek Group Co.,Ltd., China
Hongbin ZHA
Peking University, China
Xin ZHANG
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Science, China
Ping ZHANG
South China University of Technology, China
Fengjun ZHANG
Institute of Software, CAS, China
Yanguo ZHANG
China Communications Industry Association, China
Yunquan ZHANG
Institute of Computing Technology, CAS, China
Guofeng ZHANG
Zhejiang University, China
Zhong ZHOU
Beihang University, China
Bin ZHOU
Beihang University, China
Kun ZHOU
Zhejiang University, China
Mingquan ZHOU
Beijing Normal University, China
Zihan ZHOU
Penn State University, USA
