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Virtual Reality & Intelligent Hardware Editorial Board

Editor-in-Chief

Yong-Tian WANG

Beijing Institute of Technology, China

Advisors

Qin-Ping ZHAO

Beihang University, China

Bo-Hu LI

Beihang University, China

Qiong-Hai DAI

Tsinghua University, China

Guo-Zhong DAI

Institute of Software Chinese Academy of Science, China

Bjorn SCHULLER

Imperial College London, UK

David REMPEL

University of California, USA

Dieter SCHMALSTIEG

Institute of Computer Graphics and Vision at Graz University of Technology, Austria

Enhua WU

University of Macao, China

Hiroo IWATA

University of Tsukuba, Japan

Ji QIANG

Rensselaer Polytechnic Institute, USA

Mark BILLINGHURST

School of Information Technology and Mathematical Sciences, IUniversity of South Australia, Australia

Shin-Tson WU

University of Central Florida, USA

Associate Editor s

Hu-Jun BAO

Zhejiang University, China

Xi-lin CHEN

Institute of Computing Technology, Chinese Academy of Sciences, China

Ai-Min HAO

Beihang University, China

Shi-Min HU

Tsinghua University, China

Ai-Guo SONG

Southeast University, China

Jian-Hua TAO

Institute of Automation, Chinese Academy of Science, China

Feng TIAN

Institute of Software, Chinese Academy of Science, China

Xiao-Ying SUN

Jilin University, China

Guo-Ping WANG

Peking University, China

Editorial Board

Andrés Navarro CADAVID

Universidad ICESI, Colombia

Andrés Adolfo

Pontificia Universidad, Javeriana Cali, Colombia

YanLong CAO

Zhejiang University, China

Sanxing CAO

Communication University of China, China

YuanFei CHEN

Institute of Computing Technology Chinese Academy of Science in Tianjin Branch of Tianjin, China

DongYi CHEN

University of Electronic Science and Technology of China, China

Baoquan CHEN

Peking University, China

Leiting CHEN

University of Electronic Science and Technology of China, China

Yanyun CHEN

Institute of Software, CAS, China

Dewen CHENG

Beijing Institute of Technology, China

Lianglun CHENG

Guangdong University of Technology, China

Xiaoyu CHI

Goertek Group Co.,Ltd., China

Weiwen DENG

Jilin University

Henry DUH

La Trobe University, Australia

Gregory F

The University of Central Florida, USA

Xiumin FAN

Shanghai Jiao Tong University, China

Guangzheng FEI

Communication University of China

Li GUO

Hunan University

Yuansheng GUO

Electronic Components Development Research Center?Ministry of Industry and Information Technology

Yong HAN

Ocean University of China

Zengguang HOU

Institute of Automation, CAS, China

Qiang HUANG

Beijing Institute of Technology

Guoquan HUANG

University of Delaware, USA

Hiroo IWATA

University of Tsukuba, Japan

Xiangyang JI

Tsinghua University, China

Jinyuan JIA

Tongji University, China

Manolya Kavakli

Macquarie University, Australia

Kiyoshi Kiyokawa

Nara Institute of Science and Technology, Japan

Lingsheng KONG

Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China

Frederich LI

University of Durham, UK

Haifeng LI

Zhejiang University, China

Weiping LI

Peking University, China

Xueming LI

Beijing University of Posts and Telecommunications, China

Yuanqing LI

South China University of Technology, China

Xiaohui LIANG

Beihang University, China

Yue LIU

Beijing Institute of Technology

Minglei LIU

Intelligent Manufacturing Hundred People Association of China, China

Yanli LIU

Sichuan University, China

Yongjin LIU

Tsinghua University, China

Xun LUO

Tianjin University of Technology

Andrés Navarro

Universidad ICESI, Colombia

Zhigeng PAN

Hangzhou Normal University, China

Shaojie SHEN

University of Pennsylvania, Hong Kong, China

Xukun SHEN

Beihang University, China

Yuanchun SHI

Tsinghua University, China

Quanjun SONG

Institute of Intelligent Machinery, CAS, China

Weitao SONG

Beijing Film Academy, China

Haruo Takemura

Cybermedia Center Osaka University, Japan

Bruce Thomas

The University of South Australia Mawson Lakes, Australia

Changhe TU

Shandong University, China

Dangxiao WANG

Beihang University, China

Cong WANG

China Institute of Electronic Technology Standardization, China

Wei WANG

Beihang University, China

Lejin WANG

Peking University People's Hospital, China

Zhaoqi WANG

Institute of Computing Technology, CAS, China

Dongdong WENG

Beijing Institute of Technology, China

Lun XIE

University of Science and Technology Beijing, China

Le XIE

Shanghai Jiao Tong University, China

Jing XU

Intelligent Manufacturing Hundred People Association of China, China

Mingliang XU

Zhengzhou University, China

Yingqing XU

Tsinghua University, China

Zhenbang XU

Changchun Institute of Optics, Fine Mechanics and Physics, CAS, China

Jianru XUE

Xi'an Jiao Tong University, China

Jian YANG

Beijing Institute of Technology, China

Jingyi YU

Shanghai University of Science and Technology, China

Yang YU

Goertek Group Co.,Ltd., China

Hongbin ZHA

Peking University, China

Xin ZHANG

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Science, China

Ping ZHANG

South China University of Technology, China

Fengjun ZHANG

Institute of Software, CAS, China

Yanguo ZHANG

China Communications Industry Association, China

Yunquan ZHANG

Institute of Computing Technology, CAS, China

Guofeng ZHANG

Zhejiang University, China

Zhong ZHOU

Beihang University, China

Bin ZHOU

Beihang University, China

Kun ZHOU

Zhejiang University, China

Mingquan ZHOU

Beijing Normal University, China

Zihan ZHOU

Penn State University, USA

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