Associate Editor Kelvin Yeung Inducted into the 2026 Class of the AIMBE College of Fellows
Published 15 April, 2026
The American Institute for Medical and Biological Engineering (AIMBE) has announced the induction of Kelvin Yeung, Ph.D., Ng Chun-Man Professor in Orthopaedic Bioengineering in Orthopaedics and Traumatology at The University of Hong Kong to its College of Fellows.
Wai Kwok Kelvin Yeung
Department of Orthopaedics and Traumatology, The University of Hong Kong, Hong Kong, China
Election to the AIMBE College of Fellows is among the highest professional distinctions accorded to medical and biological engineers, comprised of the top two percent of engineers in these fields. College membership honors those who have made outstanding contributions to "engineering and medicine research, practice, or education” and to "the pioneering of new and developing fields of technology, making major advancements in traditional fields of medical and biological engineering or developing/implementing innovative approaches to bioengineering education."
Professor Yeung was nominated, reviewed, and elected by peers and members of the College of Fellows "for leading contributions in developing osteogenic biomaterials and antibacterial nanomaterials for musculoskeletal tissue regeneration and antibacterial treatments."
About AIMBE Fellows
AIMBE Fellows represent the top 2% of medical and biological engineers. They include the most accomplished medical and biological engineers in academia, industry, education, clinical practice, and government.
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4 AIMBE Fellows are Nobel Prize winners
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14 AIMBE Fellows have received the Presidential Medal of Technology and Innovation
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16 AIMBE Fellows have received the Presidential Medal of Science
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260 AIMBE Fellows are members of the NAE
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135 AIMBE Fellows are members of the NAM
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61 AIMBE Fellows are members of the NAS
For more details, please visit AIMBE ELECTS 2026 FELLOWS .
Now, BAM has 18 AIMBE Fellows in total:
| Role | First Name | Last Name | Affiliation |
| Editor in Chief | Yufeng | Zheng | Peking University, China |
| Editor in Chief | Jian | Yang | The Pennsylvania State University, United States |
| Associate Editor | Eben | Alsberg | University of Illinois at Chicago, United States |
| Associate Editor | Ke | Cheng | Biomedical Engineering, Columbia University, New York, NY, United States |
| Associate Editor | Debra | Auguste | Northeastern University, United States |
| Associate Editor | Rui L. | Reis | 3B´s Research Group, I3Bs, University of Minho, Guimarães, Portugal |
| Associate Editor | Cesar | de la Fuente | University of Pennsylvania, United States |
| Associate Editor | Kelvin | Yeung | The University of Hong Kong |
| Editorial Board Member | Kai | Zhang | Sichuan University, China |
| Editorial Board Member | Qiaobing | Xu | Tufts University, United States |
| Editorial Board Member | Feng | Zhao | Texas A&M University, United States |
| Editorial Board Member | Zhen | Gu | Zhejiang University, China |
| Editorial Board Member | Liping | Tang | University of Texas at Arlington, United States |
| Editorial Board Member | Yi | Hong | University of Texas at Arlington, United States |
| Editorial Board Member | Donghui | Zhu | Stony Brook University, United States |
| Editorial Board Member | Yizhou | Dong | The Ohio State University, United States |
| Editorial Board Member | Guoping | Chen | National Institute for Materials Science, Japan |
| Editorial Board Member | Malcolm | University of Manitoba, Canada |