Dynamic Soft Materials for Human-electronics Biointerfacing

Published 27 May, 2024

Dynamic soft materials-based bioelectronic technologies can be integrated onto the surface of human skin, tissue or even vital organs, where the interface provides soft mechanical coupling and facilitates efficient electrical/optical/thermal/chemical exchange.

This special issue will present the state-of-the-art research on the human-electronics biointerfacing through the functional soft materials, which featured highly desired adaptiveness, bioadhesion, mechanical compliance, electronic conductivity, and/or stimuli-responsiveness.

We also invite submissions of cross-disciplinary research among e-skin, implantable bioelectronics, transient bioelectronics, bioadhesion, electrophysiological recording and modulation; as well as bio-inspired and bio-integrated design and fabrication of functional soft materials through multi-length scale hierarchical control and advanced manufacturing.

Topics covered:

  • Dynamic hydrogels
  • Bioadhesion
  • Biointerface
  • Hydrogel bioelectronics
  • Biointerfacing

Important Deadlines:

  • Submission deadline: December 31, 2024.

Submission Instructions: 

Please read the [Guide for Authors] before submitting. All articles should be [submitted online], please select [VSI: Dynamic Soft Matls for Human-electronics Biointerfacing] on submission.

Guest Editors:

  • Prof. Ji Liu, Southern University of Science and Technology, liuj9@sustech.edu.cn
  • Prof. Ben Xu, NorthumbriaUniversity, ben.xu@northumbria.ac.uk
  • Prof. XiaokongLiu, Jilin University, xiaokongliu@jlu.edu.cn

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